LT8331 datasheet(28/30 Pages) AD

28 / 30 page

LT8365

Rev. A

For more information www.analog.com

PACKAGE DESCRIPTION

MSOP (MSE16(12)) 0213 REV D

0.53 ±0.152

(.021 ±.006)

SEATING

PLANE

0.18

(.007)

1.10

(.043)

MAX

0.17 –0.27

(.007 – .011)

TYP

0.86

(.034)

REF

0.50

(.0197)

BSC

1.0

(.039)

BSC

1.0

(.039)

BSC

16 14 121110

3 5 6 7 8

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL

NOT EXCEED 0.254mm (.010") PER SIDE.

0.254

(.010)

0° – 6° TYP

DETAIL “A”

GAUGE PLANE

5.10

(.201)

MIN

3.20 – 3.45

(.126 – .136)

0.889 ±0.127

(.035 ±.005)

RECOMMENDED SOLDER PAD LAYOUT

0.305 ±0.038

(.0120 ±.0015)

TYP

0.50

(.0197)

BSC

BOTTOM VIEW OF

EXPOSED PAD OPTION

2.845 ±0.102

(.112 ±.004)

2.845 ±0.102

(.112 ±.004)

4.039 ±0.102

(.159 ±.004)

(NOTE 3)

1.651 ±0.102

(.065 ±.004)

1.651 ±0.102

(.065 ±.004)

0.1016 ±0.0508

(.004 ±.002)

3.00 ±0.102

(.118 ±.004)

(NOTE 4)

0.280 ±0.076

(.011 ±.003)

REF

4.90 ±0.152

(.193 ±.006)

DETAIL “B”

CORNER TAIL IS PART OF

THE LEADFRAME FEATURE.

FOR REFERENCE ONLY

NO MEASUREMENT PURPOSE

0.12 REF

0.35

REF

MSE Package

Variation: MSE16 (12)

16-Lead Plastic MSOP with 4 Pins Removed

Exposed Die Pad

(Reference LTC DWG # 05-08-1871 Rev D)

LT8331 Datasheet(PDF) 28 Page - Analog Devices

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