STM32WB55 datasheet(183/193 Pages) STMICROELECTRONICS

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DS11929 Rev 11

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STM32WB55xx STM32WB35xx

Package information

185

7.5

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 24: General operating conditions.

The maximum chip-junction temperature, TJ max, in degrees Celsius, can be calculated

using the equation:

TJ max = TA max + (PD max x ΘJA)

where:



TA max is the maximum ambient temperature in °C,



ΘJA is the package junction-to-ambient thermal resistance, in °C / W,



PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/O max),



PINT max is the product of IDD and VDD, expressed in Watt. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins:



PI/O max = Σ (VOL × IOL) + Σ ((VDD – VOH) × IOH)

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Note:

When the SMPS is used, a portion of the power consumption is dissipated into the external

inductor, therefore reducing the chip power dissipation. This portion depends mainly on the

inductor ESR characteristics.

Note:

As the radiated RF power is quite low (< 4 mW), it is not necessary to remove it from the

chip power consumption.

Note:

RF characteristics (such as sensitivity, Tx power, consumption) are provided up to 85 °C.

Table 106. Package thermal characteristics

Symbol

Parameter

Value

Unit

ΘJA

Thermal resistance junction-ambient

UFQFPN48 - 7 mm x 7 mm

24.9

°C/W

Thermal resistance junction-ambient

VFQFPN68 - 8 mm x 8 mm

47.0

Thermal resistance junction-ambient

WLCSP100 - 0.4 mm pitch

35.8

Thermal resistance junction-ambient

UFBGA129 - 0.5 mm pitch

41.5

ΘJB

Thermal resistance junction-board

UFQFPN48 - 7 mm x 7 mm

13.0

°C/W

Thermal resistance junction-board

VFQFPN68 - 8 mm x 8 mm

36.1

Thermal resistance junction-board

WLCSP100 - 0.4 mm pitch

N/A

Thermal resistance junction-board

UFBGA129 - 0.5 mm pitch

16.2

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