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MIC2810 Datasheet(PDF) 14 Page - Microchip Technology

Part # MIC2810
Description  Digital Power Management IC 2 MHz, 600 mA DC/DC with Dual 300 mA/300 mA Low VIN LDOs
PDF  26 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MIC2810 Datasheet(HTML) 14 Page - Microchip Technology

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MIC2810
DS20005910B-page 14
2017 - 2022 Microchip Technology Inc. and its subsidiaries.
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
3.1
LOWQ
The LOWQ pin provides a logic level control between
the internal PWM switching regulator mode, and the
low noise linear regulator mode. With LOWQ pulled low
(≤ 0.2V), quiescent current of the device is greatly
reduced by switching to a low noise linear regulator
mode that has a typical supply current of 38 µA. In
linear (LDO) mode, the output can deliver 60 mA of
current to the output. By placing LOWQ high (≥ 1V), the
device transitions into a constant frequency PWM
step-down regulator mode. This allows the device the
ability to efficiently deliver up to 600 mA of output
current at the same output voltage.
LOWQ mode also limits the output load of both LDO1
and LDO2 to less than 50 mA.
3.2
BIAS
The BIAS pin supplies the power to the internal control
and reference circuitry. The bias is powered from VIN
through an internal 6Ω resistor. A small 0.1 µF
capacitor is required for bypassing.
3.3
SGND
Signal ground (SGND) is the ground path for the
biasing and control circuitry. The current loop for the
signal ground should be as small as possible.
3.4
PGND
Power ground (PGND) is the ground path for the high
current PWM mode. The current loop for the power
ground should be as small as possible.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number Pin Name
Description
1
LOWQ
LOWQ Mode. Active Low Input. Logic High = Full Power Mode; Logic Low = LOWQ
Mode; Do not leave floating.
2
BIAS
Internal circuit bias supply. It must be decoupled to signal ground with a 0.1 µF
capacitor and should not be loaded.
3
SGND
Signal ground.
4
PGND
Power ground.
5
SW
Switch (Output): Internal power MOSFET output switches.
6
VIN
Supply Input – DC/DC and other circuitry shared with LDO1 and LDO2. Must be
connected to Pin 7.
7
VIN2
Supply Input – LDO2. Must be connected to Pin 6.
8
LDO2
Output of LDO regulator 2.
9
LDO
LDO Output: Connect to VOUT of the DC/DC for LOWQ mode operation.
10
VIN1
Supply Input – LDO1.
11
LDO1
Output of LDO regulator 1.
12
POR
Power-on Reset Output: Open-drain output. Active low indicates an output
undervoltage condition on either one of the three regulated outputs.
13
CSET
Delay Set Input: Connect external capacitor to GND to set the internal delay for the
POR output. When left open, there is a minimum delay. This pin cannot be grounded.
14
EN1
Enable Input (LDO1). Active High Input. Logic high = On; Logic low = Off; do not leave
floating.
15
EN
Enable Input (DC/DC). Active High Input. Logic High = On; Logic Low = Off; Do not
leave floating.
16
EN2
Enable Input (LDO2). Active High Input. Logic high = On; Logic low = Off; do not leave
floating.



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