SPC572L60F2 datasheet(23/112 Pages) STMICROELECTRONICS

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SPC572Lx

Electrical characteristics

111

3.8

I/O pad specification

The following table describes the different pad type configurations.

Table 10. DC electrical specifications(1)

Symbol

Parameter

Conditions

Value

Unit

Min

Typ

Max

IDD

CC P Operating current all

supply rails

fMAX(2)

—

145

IDDPE

CC C Operating current all

supplies including

program/erase

fMAX(3)

—

165

IDDAPP

CC P Operating current all

supplies with typical

application

At TJ<150°C

—

125

IDDAR

CC P VDD_HV_IO After Run

operating current

At 40 °C

Total device consumption

on VDD_HV_IO, including

consumption for VDD_LV

generation.

No I/O activity

——

CC T

After-run mode HV

current, TA =55 °C,

VDD_HV_IO = 5.5 V

——

ISPIKE

CC T Maximum short term

current spike

< 20 µs observation

window

——

CC T Current difference ratio to

average current (dI/avg(I))

< 20 µs observation

window

——

ISR

CC D Current variation during

boot/shut-down

——

—

VREF_BG_T

CC P Bandgap trimmed

reference voltage

TJ = –40 °C to 150 °C

VDD_HV_ADV = 5 V + 10%

1.200

—

1.237

VREF_BG_TC

CC C Bandgap temperature

coefficient(4)

TJ = –40 °C to 150 °C

VDD_HV_ADV = 5 V + 10%

-50

—

ppm

/°C

VREF_BG_LR

CC C Bandgap line regulation

TJ = –40 °C

VDD_HV_ADV = 5 V + 10%

—

8000

ppm

CTJ = 150 °C

VDD_HV_ADV = 5 V + 10%

—

4000

1. The ranges in this table are design targets and actual data may vary in the given range.

2. fMAX as specified per IP, unloaded I/O with LVDS pins active and terminated. Measured on an application specific pattern.

3. fMAX as specified per IP, unloaded I/O with LVDS pins active and terminated. Measured on an application specific pattern

with active flash program and erase.

4. The temperature coefficient and line regulation specifications are used to calculate the reference voltage drift at an

operating point within the specified voltage and temperature operating conditions.

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