SPC584BX datasheet(124/142 Pages) STMICROELECTRONICS

124 / 142 page

Package information

SPC584Bx

124/142

DS11701 Rev 4

5.5.3

eTQFP144

5.5.4

LQFP176

4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

5. Thermal resistance between the die and the exposed pad ground on the bottom of the package based on simulation

without any interface resistance.

6. Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2.

Table 71. Thermal characteristics for 144 exposed pad eTQFP package

Symbol

Parameter(1)

Conditions

Value

Unit

RJA

D Junction-to-Ambient, Natural Convection(2) Four layer board (2s2p)

28.5

°C/W

RJMA

Junction-to-Moving-Air, Ambient(2)

At 200 ft./min., four layer

board (2s2p)

22.1

°C/W

RJB

Junction-to-board(3)

—

14.5

°C/W

RJCtop

Junction-to-case top(4)

—

13.7

°C/W

RJCbottom CC D

Junction-to-case bottom(5)

—4.4

°C/W



Junction-to-package top(6)

Natural convection

3.7

°C/W

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

5. Thermal resistance between the die and the exposed pad ground on the bottom of the package based on simulation

without any interface resistance.

6. Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2.

Table 72. Thermal characteristics for 176 exposed pad LQFP package

Symbol

Parameter(1)

Conditions

Value

Unit

RJA

D Junction-to-Ambient, Natural Convection(2) Four layer board (2s2p)

°C/W

RJMA

Junction-to-Moving-Air, Ambient(2)

at 200 ft./min., four layer

board (2s2p)

°C/W

RJB

Junction-to-board(3)

15.7

°C/W

RJCtop

Junction-to-case top(4)

18.1

°C/W

RJCbottom CC D

Junction-to-case bottom(5)

—

4.0

°C/W



Junction-to-package top(6)

Natural convection

3.7

°C/W

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

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