SPC584BX datasheet(127/142 Pages) STMICROELECTRONICS

Part #	SPC584BX

Description	32-bit Power Architecture microcontroller for automotive ASIL-B applications

PDF	142 Pages

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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127 / 142 page

DS11701 Rev 4

127/142

SPC584Bx

Package information

127

The thermal characterization parameter is measured in compliance with the JESD51-2

specification using a 40-gauge type T thermocouple epoxied to the top center of the

package case. Position the thermocouple so that the thermocouple junction rests on the

package. Place a small amount of epoxy on the thermocouple junction and approximately 1

mm of wire extending from the junction. Place the thermocouple wire flat against the

package case to avoid measurement errors caused by the cooling effects of the

thermocouple wire.

When board temperature is perfectly defined below the device, it is possible to use the

thermal characterization parameter (

JPB) to determine the junction temperature by

measuring the temperature at the bottom center of the package case (exposed pad) using

the following equation:

Equation 5

TJ = TB + (JPB x PD)

where:

TT = thermocouple temperature on bottom of the package (°C)

JT = thermal characterization parameter (°C/W)

PD = power dissipation in the package (W)

SPC584BX Datasheet(PDF) 127 Page - STMicroelectronics