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MGC3030 Datasheet(PDF) 32 Page - Microchip Technology |
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MGC3030 Datasheet(HTML) 32 Page - Microchip Technology |
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32 / 46 page  8.5 Reference Schematic North Electrode South Electrode Center Electrode VDD 10 KΩ 10 KΩ 10 KΩ 10 KΩ IS1 IS2 VDD VDD n.p: not populated IS1 IS2 SDA SCL GPIO/IRQ HOST RESET CONTROL MCLR MCLR VDD VDD VDD VDD TX Electrode VDD VDD TX4 R0 = 4.7K 1) R1 = 4.7K 1) R2 = 4.7K 1) R3 = 1K 1) R4 = 1K 1) TX1 TX0 TX2 TX3 TX4 GP5 SYNC DNC RX1 DNC DNC MCLR VSS VDD IS1 IS2 RX2 1 2 3 4 5 6 7 8 9 10 11 12 DNC DNC VSS TS MODE VDD SCL SDA TX4 TX3 TX2 TX1 36 35 34 33 32 31 30 29 28 27 26 25 10 KΩ 10 μF C1 = 470pF 1) MGC3140-E/MV Test Point TX3 TX2 TX1 MODE NC SYNC VDD Notes: 1. Specific values should be reviewed with a Microchip representative. 2. The values of pull-up resistors need to be chosen to ensure that SCL and SDA rise and fall times meet the I2C specification. The value required will depend on the amount of capacitance loading on the lines. 8.6 Layout Recommendation This section provides a brief description of layout hints for a proper system design. The PCB layout requirements for MGC3140 follow the general rules for a mixed signal design. In addition, there are certain requirements to be considered for the sensor signals and electrode feeding lines. The chip must be placed as close as possible to the electrodes to keep their feeding lines as short as possible. Furthermore, it is recommended to keep MGC3140 away from electrical and thermal sources within the system. A two-layer PCB layout is sufficient to enable analog and digital signals to be separated from each other to minimize crosstalk. The individual electrode feeding lines must be kept as far as possible apart from each other. VDD lines must be routed as wide as possible. MGC3140 requires a proper ground connection on all VSS pins which can be connected together. MGC3140 Application Architecture © 2018-2022 Microchip Technology Inc. and its subsidiaries Advance Information Datasheet DS40002037C-page 32 |
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