ISOW7744FDFMR datasheet(3/63 Pages) TI

3 / 63 page

5 Description (continued)

The high-efficiency of the power converter allows for operation at a wide operating ambient temperature range

of –40°C to +125°C. This device provides improved emissions performance, allowing for simplified board design

and has provisions for ferrite beads to further attenuate emissions. The ISOW774x has been designed with

enhanced protection features in mind, including soft-start to limit inrush current, over-voltage and under-voltage

lock out, fault detection on the EN/FLT pin, overload and short-circuit protection, and thermal shutdown.

The ISOW77xx family of devices provide high electromagnetic immunity while isolating CMOS or LVCMOS

digital I/Os. The signal-isolation channel has a logic input and output buffer separated by a double capacitive

silicon dioxide (SiO2) insulation barrier, whereas, power isolation uses on-chip transformers separated by thin

film polymer as insulating material. There are five orderable configurations of four channel ISOW77xx flavor

using the last part number digit to note the number of reverse channels. For example, the ISOW7740 has 4

forward channels and 0 reverse channels, while the ISOW7743 would have 1 forward channel and 3 reverse

channels. If the input signal is lost, the default output is high for the ISOW77xx devices without the F suffix and

low for the ISOW77xx devices with the F suffix. The ISOW774x can operate from a single supply voltage of 3 V

to 5.5 V by connecting VIO and VDD together on PCB. If lower logic levels are required, these devices support

1.71 V to 5.5 V logic supply (VIO) that can be independent from the power converter supply (VDD) of 3 V to 5.5 V.

VISOIN and VISOOUT needs to be connected on board with either a ferrite bead or fed through a LDO.

These devices help prevent noise currents on data buses, such as UART, SPI, RS-485, RS-232, and CAN,

or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. Through

innovative chip design and layout techniques, electromagnetic compatibility of the device has been significantly

enhanced to ease system-level ESD, EFT, surge and emissions compliance. The device is available in a 20-pin

SOIC wide-body (SOIC-WB) DFM package.

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ISOW7740, ISOW7741, ISOW7742, ISOW7743, ISOW7744

SLLSFK1C – SEPTEMBER 2021 – REVISED APRIL 2022

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ISOW7744FDFMR Datasheet(PDF) 3 Page - Texas Instruments