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LTM2887 Datasheet(PDF) 28 Page - Analog Devices

Part # LTM2887
Description  7.5kVRMS SPI/Digital or I2C 關Module Isolator with Transformer Driver
PDF  30 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

LTM2887 Datasheet(HTML) 28 Page - Analog Devices

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LTM2810
28
Rev. A
For more information www.analog.com
PACKAGE DESCRIPTION
PACKAGE TOP VIEW
4
PIN “A1”
CORNER
Y
X
aaa Z
aaa Z
BGA Package
36-Lead (22mm
× 6.25mm × 2.06mm)
(Reference LTC DWG# 05-08-1588 Rev Ø)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
3
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DETAIL A
Øb (36 PLACES)
A
DETAIL B
PACKAGE SIDE VIEW
M
X Y
Z
ddd
M Z
eee
A2
D
E
SUGGESTED PCB LAYOUT
TOP VIEW
0.00
9.375
10.375
10.375
9.375
10.075
10.675
0.50 ±0.025 Ø 36x
BGA 36 0817 REV Ø
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
LTMXXXXXX
µModule
PACKAGE BOTTOM VIEW
X
W
V
U
T
S
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1
2
3
4
5
6
DETAIL A
3
SEE NOTES
PIN 1
e
e
F
G
b
8.375
8.375
6
SEE NOTES
b
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
1.81
0.40
1.41
0.50
0.47
0.46
0.95
NOM
2.06
0.50
1.56
0.60
0.50
22.0
6.25
1.0
20.75
5.0
0.56
1.00
MAX
2.31
0.60
1.71
0.70
0.53
0.66
1.05
0.15
0.10
0.15
0.15
0.08
TOTAL NUMBER OF BALLS: 36
DIMENSIONS
NOTES
BALL HT
BALL DIMENSION
PAD DIMENSION
SUBSTRATE THK
MOLD CAP HT
DETAIL B
SUBSTRATE
A1
ccc Z
H2
H1
b1
MOLD
CAP
5. PRIMARY DATUM -Z- IS SEATING PLANE
6
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
!



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