ACEPACK SMIT

1

6

4

3

9

8

7

1

3

4

6

9

8

7

9 (DC+)

7 (U)

8 (DC-)

1 (GHS)

2 (KHS)

3, 4 (NC)

6 (GLS)

5 (KLS)

GADG060720221002SA

Features

Order code

SH32N65DM6AG

650 V

97 mΩ

32 A

•

AQG 324 qualified

•

Half-bridge power module

•

650 V blocking voltage

•

Fast recovery body diode

•

Very low switching energies

•

Low package inductance

•

Dice on direct bond copper (DBC) substrate

•

Low thermal resistance

•

Isolation rating of 3.4 kVrms/min

Applications

•

Switching applications

Description

This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT

is a very compact and rugged power module in a surface mount package for easy

assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low

thermal resistance coupled with an isolated top-side thermal pad. The high design

flexibility of the package enables several configurations, including phase legs, boost,

and single switch through different combinations of the internal power switches.

Product status link

SH32N65DM6AG

Product summary

Order code

SH32N65DM6AG

Marking

H32N65DM6

Package

ACEPACK SMIT

Packing

Tape and reel

Automotive-grade N-channel 650 V, 89 mΩ typ., 32 A MDmesh DM6

half

‑bridge topology Power MOSFET in an ACEPACK SMIT package

SH32N65DM6AG

Datasheet

DS14049 - Rev 2 - October 2022

For further information contact your local STMicroelectronics sales office.

www.st.com