TCR2EF series, TCR2EE series

2019-06-20

6

© 2017-2019

Toshiba Electronic Devices & Storage Corporation

Application Note

1.

Examples of Application Circuit

SMV

ESV

The figures above show the examples of configuration for using a Low dropout regulator. Insert a capacitor at VOUT and

VIN pins for stable input/output operation. (Ceramic capacitors can be used).

2. Power Dissipation

Both unit and board mounted power dissipation ratings for TCR2EF series and TCR2EE series are available in the Absolute

Maximum Ratings table.

Power dissipation is measured on the board shown below.

Test Board for Thermal Resistance

CONTROL pin

connection

Operation

HIGH

ON

LOW

OFF

OPEN

OFF

SMV

ESV

Ambient temperature Ta (℃)

PD – Ta (ESV)

−40

0

0

40

120

80

100

200

300

400

①

②

①

Board dimension 30 mm x 30 mm,

x 0.8 mm Copper area 20 mm2,

mounted on FR4 Board

②

Unit Rating

*Board material: FR4 board

Board dimension: 30 mm × 30 mm × 0.8 mm

Copper area: 20 mm2

*Board material: FR4 board

Board dimension: 25.4 mm × 25.4 mm × 1.6 mm

Copper area: 645 mm2

VOUT

GND

VIN

CONTROL

NC

VOUT

GND VIN

CONTROL

NC

Ambient temperature Ta (℃)

PD – Ta (SMV)

−40

0

0

40

120

80

200

400

600

800

①

Board dimension 25.4 mm x 25.4 mm, x

1.6 mm Copper area 645 mm2,

mounted on FR4 Board

②

Unit Rating

②

①