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74F845 Datasheet(PDF) 10 Page - NXP Semiconductors

Part # 74F845
Description  Bus interface latches
PDF  18 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

74F845 Datasheet(HTML) 10 Page - NXP Semiconductors

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Philips Semiconductors
Product specification
74F841/74F842/74F843/
74F845/74F846
Bus interface latches
1999 Jun 23
10
DC ELECTRICAL CHARACTERISTICS
Over recommended operating free-air temperature range unless otherwise noted.
SYMBOL
PARAMETER
TEST CONDITIONS1
LIMITS
UNIT
SYMBOL
PARAMETER
TEST CONDITIONS1
MIN
TYP2
MAX
UNIT
IO = 15mA
±10%VCC
2.2
V
VO
High level output voltage
VCC = MIN,
IOH = –15mA
±5%VCC
2.2
3.3
V
VOH
High-level output voltage
CC
,
VIL = MAX, VIH = MIN
IO = 24mA
±10%VCC
2.0
V
IOH = –24mA
±5%VCC
2.0
V
VO
Low level output voltage
VCC = MIN,
IOL = 32mA
±10%VCC
0.38
0.55
V
VOL
Low-level output voltage
CC
,
VIL = MAX, VIH = MIN
IOL = 48mA
±5%VCC
0.38
0.55
V
VIK
Input clamp voltage
VCC = MIN, II = IIK
–0.73
–1.2
V
II
Input current at maximum input voltage
VCC = 0.0V, VI = 7.0V
100
µA
IIH
High-level input current
VCC = MAX, VI = 2.7V
20
µA
IIL
Low-level input current
VCC = MAX, VI = 0.5V
–20
µA
IOZH
Off-state output current,
High-level voltage applied
VCC = MAX, VO = 2.7V
50
µA
IOZL
Off-state output current,
Low-level voltage applied
VCC = MAX, VO = 0.5V
–50
µA
IOS
Short-circuit output current3
VCC = MAX
–100
–225
mA
ICCH
50
65
mA
74F841
ICCL
VCC = MAX
60
80
mA
ICCZ
70
92
mA
ICCH
40
60
mA
74F842
ICCL
VCC = MAX
65
90
mA
ICC
Supply current
ICCZ
60
90
mA
ICC
y
(total)
ICCH
65
90
mA
74F843
74F845
ICCL
VCC = MAX
75
100
mA
74F845
ICCZ
85
115
mA
ICCH
50
70
mA
74F846
ICCL
VCC = MAX
70
95
mA
ICCZ
70
95
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter test, IOS tests should be performed last.



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