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AM69AX Datasheet(PDF) 147 Page - Texas Instruments

Part # AM69AX
Description  AM69Ax Processors, Silicon Revision 1.0
PDF  299 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

AM69AX Datasheet(HTML) 147 Page - Texas Instruments

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7.8 Thermal Resistance Characteristics
This section provides the thermal resistance characteristics used on this device.
For reliability and operability concerns, the maximum junction temperature of the device has to be at or below
the TJ value identified in Recommended Operating Conditions.
7.8.1 Thermal Resistance Characteristics for ALY Package
It is recommended to perform thermal simulations at the system level with the worst case device power consumption.
NO.
PARAMETER
DESCRIPTION
ALY PACKAGE
°C/W(1) (3)
AIR FLOW
(m/s)(2)
T1
RΘJC
Junction-to-case
0.11
N/A
T2
RΘJB
Junction-to-board
1.6
N/A
T3
RΘJA
Junction-to-free air
8.3
0
T4
Junction-to-moving air
4.7
1
T5
3.9
2
T7
ΨJT
Junction-to-package top
0.1
0
T8
0.1
1
T9
0.1
2
T11
ΨJB
Junction-to-board
1.3
0
T12
1.1
1
T13
1.0
2
(1)
These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on
a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
•
JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
•
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
•
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-9, Test Boards for Area Array Surface Mount Packages
(2)
m/s = meters per second.
(3)
°C/W = degrees Celsius per watt.
www.ti.com
AM69A
SPRSP92 – FEBRUARY 2023
Copyright © 2023 Texas Instruments Incorporated
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Product Folder Links: AM69A



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