Datasheet

4-Feb-2022

CFR0011-120-01

Revision 1.04

Page 16 of 18

SLG59M1735C

A 10.5 mΩ, 4 A Load Switch

with Soft-start and Protection Features in WLCSP

©2022 Renesas Electronics Corporation

Recommended Reflow Soldering Profile

For successful reflow of the SLG59M1735C a recommended thermal profile is illustrated below:

Note: This reflow profile is for classification/preconditioning and are not meant to specify board assembly profile. Actual board

assembly profiles should be developed based on specific process needs and board designs and should not exceed parameters

depicted on figure above.

Please see more information on IPC/JEDEC J-STD-020: latest revision for reflow profile based on package volume of 0.486 mm3

(nominal).