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IRS2011(S)PbF

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-

eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured

under board mounted and still air conditions.

Symbol

Definition

Min.

Max.

Units

High-side floating supply voltage

-0.3

220 (Note 1)

High-side floating supply offset voltage

High-side floating output voltage

Low-side fixed supply voltage

-0.3

20 (Note 1)

Low-side output voltage

-0.3

Logic input voltage (HIN & LIN)

-0.3

Allowable offset supply voltage transient (Fig. 2)

—

50

V/ns

(8-lead DIP)

—

1.0

(8-lead SOIC)

—

0.625

Thermal resistance, junction to ambient

(8-lead DIP)

—

125

(8-lead SOIC)

—

200

Junction temperature

—

150

Storage temperature

-55

150

Lead temperature (soldering, 10 seconds)

—

300

°C/W

W

V

°C

Symbol

Definition

Min.

Max.

Units

High-side floating supply absolute voltage

High-side floating supply offset voltage

Note 2

200

High-side floating output voltage

Low-side fixed supply voltage

10

20

Low-side output voltage

0

Logic input voltage (HIN & LIN)

COM

5.5

Ambient temperature

-40

125

°C

Recommended Operating Conditions

For proper operation the device should be used within the recommended conditions. The VS and COM offset ratings

are tested with all supplies biased at a 15 V differential.

V

Note 1: All supplies are fully tested at 25 V and an internal 20 V clamp exists for each supply.