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STL90N10F7 Datasheet(PDF) 3 Page - STMicroelectronics |
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STL90N10F7 Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 16 page ![]() 2 Electrical characteristics (TC = 25 °C unless otherwise specified) Table 3. Static Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)DSS Drain-source breakdown voltage VGS = 0 V, ID = 250 µA 100 V IDSS Zero gate voltage drain current VGS = 0 V, VDS = 100 V 1 µA VGS = 0 V, VDS = 100 V, TC = 125 °C 100 µA IGSS Gate-body leakage current VDS = 0 V, VGS = 20 V 100 nA VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µA 2.5 3.5 4.5 V RDS(on) Static drain-source on-resistance VGS = 10 V, ID = 8 A 7 8 mΩ Table 4. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit Ciss Input capacitance VDS = 50 V, f = 1 MHz, VGS = 0 V - 3100 4030 pF Coss Output capacitance - 700 910 pF Crss Reverse transfer capacitance - 45 58 pF Qg Total gate charge VDD = 50 V, ID = 16 A, VGS = 10 V (see Figure 13. Test circuit for gate charge behavior) - 45 60 nC Qgs Gate-source charge - 18 nC Qgd Gate-drain charge - 13 nC Table 5. Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time VDD = 50 V, ID = 8 A, RG = 4.7 Ω, VGS = 10 V (see Figure 12. Test circuit for resistive load switching times and Figure 17. Switching time waveform) - 19 - ns tr Rise time - 32 - ns td(off) Turn-off-delay time - 36 - ns tf Fall time - 13 - ns Table 6. Source-drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit VSD (1) Forward on voltage VGS = 0 V, ISD = 16 A - 1.1 V trr Reverse recovery time ISD = 16 A, di/dt = 100 A/µs, VDD = 80 V, TJ = 150 °C (see Figure 14. Test circuit for inductive load switching and diode recovery times) - 70 90 ns Qrr Reverse recovery charge - 125 nC IRRM Reverse recovery current - 3.6 A 1. Pulse test: pulse duration = 300 µs, duty cycle 1.5%. STL90N10F7 Electrical characteristics DS9621 - Rev 7 page 3/16 |
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