1996 Sep 26

3

Philips Semiconductors

Product specification

Damper diode

BY448

THERMAL CHARACTERISTICS

Note

1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer

≥40 µm, see Fig.4.

For more information please refer to the

“General Part of associated Handbook”.

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to tie-point

lead length = 10 mm

46

K/W

thermal resistance from junction to ambient

note 1

100

K/W

mounted as shown in Fig.5

55

K/W