11.6.2

Shock precautions

Sensor modules house numerous internal components that are susceptible to shock damage. If a unit is subject

to excessive shock, is dropped on the floor, or a tray/reel of units is dropped on the floor, it must be rejected, even

if no apparent damage is visible.

11.6.3

Part handling

Handling must be done with nonmarring ESD safe carbon, plastic, or teflon tweezers. Ranging modules are

susceptible to damage or contamination. The customer is advised to use a clean assembly process until a

protective cover glass is mounted.

11.6.4

Compression force

A maximum compressive load of 25 N should be applied on the module.

11.6.5

Moisture sensitivity level

Moisture sensitivity is level 3 (MSL) as described in IPC/JEDEC JSTD-020-C.

Note:

If devices are stored out of the packaging for greater than 168 h, the devices should be baked before use. The

optimum bake recommended is at 90°C for a minimum of 6 hours.

11.7

Storage temperature conditions

Table 26. Recommended storage conditions

Parameter

Min.

Typ.

Max.

Unit

Temperature (storage)

-40

23

90

°C

VL53L8CH

Storage temperature conditions

DS14310 - Rev 3

page 38/44