PKB4313D datasheet(25/28 Pages) FLEX

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Soldering Information - Surface Mounting

The surface mount product is intended for forced convection or

vapor phase reflow soldering in SnPb and Pb-free processes.

The reflow profile should be optimised to avoid excessive

heating of the product. It is recommended to have a sufficiently

extended preheat time to ensure an even temperature across

the host PWB and it is also recommended to minimize the time

in reflow.

A no-clean flux is recommended to avoid entrapment of

cleaning fluids in cavities inside the product or between the

product and the host board, since cleaning residues may affect

long time reliability and isolation voltage.

General reflow process specifications

SnPb eutectic

Pb-free

Average ramp-up (TPRODUCT)

3°C/s max

Typical solder melting (liquidus)

temperature

183°C

221°C

Minimum reflow time above TL

60 s

Minimum pin temperature

TPIN

210°C

235°C

Peak product temperature

TPRODUCT

225°C

260°C

Average ramp-down (TPRODUCT)

6°C/s max

Maximum time 25°C to peak

6 minutes

8 minutes

PRODUCT maximum

PIN minimum

Time

profile

Product

profile

Time in

reflow

Time in preheat

/ soak zone

Time 25°C to peak

Temperature

Minimum Pin Temperature Recommendations

Pin number 4 is chosen as reference location for the minimum

pin temperature recommendation since this will likely be the

coolest solder joint during the reflow process.

SnPb solder processes

For SnPb solder processes, a pin temperature (TPIN) in excess

of the solder melting temperature, (TL, 183°C for Sn63Pb37) for

more than 60 seconds and a peak temperature of 220°C is

recommended to ensure a reliable solder joint.

For dry packed products only: depending on the type of solder

paste and flux system used on the host board, up to a

recommended maximum temperature of 245°C could be used,

if the products are kept in a controlled environment (dry pack

handling and storage) prior to assembly.

Lead-free (Pb-free) solder processes

For Pb-free solder processes, a pin temperature (TPIN) in

excess of the solder melting temperature (TL, 217 to 221°C for

SnAgCu solder alloys) for more than 60 seconds and a peak

temperature of 245°C on all solder joints is recommended to

ensure a reliable solder joint.

Maximum Product Temperature Requirements

Top of the product PWB near pin 2 is chosen as reference

location for the maximum (peak) allowed product temperature

(TPRODUCT) since this will likely be the warmest part of the

product during the reflow process.

SnPb solder processes

For SnPb solder processes, the product is qualified for MSL 1

according to IPC/JEDEC standard J-STD-020C.

During reflow TPRODUCT must not exceed 225 °C at any time.

Pb-free solder processes

For Pb-free solder processes, the product is qualified for MSL 3

according to IPC/JEDEC standard J-STD-020C.

During reflow TPRODUCT must not exceed 260 °C at any time.

Dry Pack Information

Products intended for Pb-free reflow soldering processes are

delivered in standard moisture barrier bags according to

IPC/JEDEC standard J-STD-033 (Handling, packing, shipping

and use of moisture/reflow sensitivity surface mount devices).

Using products in high temperature Pb-free soldering

processes requires dry pack storage and handling. In case the

products have been stored in an uncontrolled environment and

no longer can be considered dry, the modules must be baked

according to J-STD-033.

Thermocoupler Attachment

Top of PWB near pin 2 for measurement of maximum product

temperature, TPRODUCT

Pin 4 for measurement of minimum pin (solder joint) temperature, TPIN

PKB4000D series Fully regulated DC-DC Converters

Input 36-75 V, Output up to 25 A / 300 W

28701-BMR674 01 Rev G

July 2019

Technical Speciﬁcation

PKB4313D Datasheet(PDF) 25 Page - Flex Power Modules. FLEX LTD.

PKB4313D Datasheet(HTML) 25 Page - Flex Power Modules. FLEX LTD.

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