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AD8315ARMZ Datasheet(PDF) 20 Page - Analog Devices |
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AD8315ARMZ Datasheet(HTML) 20 Page - Analog Devices |
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20 / 24 page ![]() AD8315 Rev. C | Page 20 of 24 ANTENNA STRIPLINE PA AD8315 RFIN CC RIN CIN RATTN Figure 42. Series Attention Input Coupling Option Figure 42 shows a third method for coupling the input signal into the AD8315. A series resistor, connected to the RF source, combines with the input impedance of the AD8315 to resistively divide the input signal being applied to the input. This has the advantage of very little power being tapped off in RF power transmission applications. USING THE CHIP SCALE PACKAGE On the underside of the chip scale package, there is an exposed paddle. This paddle is internally connected to the chip’s ground. There is no thermal requirement to solder the paddle down to the printed circuit board’s ground plane. However, soldering down the paddle has been shown to increase the stability over frequency of the AD8315 ACP’s response at low input power levels (that is, at around −45 dBm) in the DCS and PCS bands. EVALUATION BOARD Figure 43 shows the schematic of the AD8315 MSOP evaluation board. The layout and silkscreen of the component side are shown in Figure 44 and Figure 45. An evaluation board is also available for the LFCSP package (see the Ordering Guide for exact part numbers). Apart from the slightly smaller device footprint, the LFCSP evaluation board is identical to the MSOP board. The board is powered by a single supply in the 2.7 V to 5.5 V range. The power supply is decoupled by a single 0.1 μF capacitor. Table 5 details the various configuration options of the evaluation board. 1 2 3 4 5 6 7 8 C1 0.1µF TP1 VPOS R3 0Ω R4 (OPEN) C2 (OPEN) TP2 RFIN ENBL VSET FLTR VPOS VAPC NC COMM AD8315 R1 0Ω VPOS SW1 J1 J2 RFIN VSET C4 (OPEN) LK1 LK2 NC = NO CONNECT VPOS C5 0.1µF R8 10kΩ C3 0.1µF R7 16.2kΩ R6 17.8kΩ R5 10kΩ AD8031 R2 52.3Ω J2 VAPC Figure 43. Evaluation Board Schematic (MSOP) Table 5. Evaluation Board Configuration Options Component Function Default Condition TP1, TP2 Supply and Ground Vector Pins. Not Applicable SW1 Device Enable. When in Position A, the ENBL pin is connected to VPOS and the AD8315 is in operating mode. In Position B, the ENBL pin is grounded putting the device in power-down mode. SW1 = A R1, R2 Input Interface. The 52.3 Ω resistor in Position R2 combines with the AD8315’s internal input impedance to give a broadband input impedance of around 50 Ω. A reactive match can be implemented by replacing R2 with an inductor and R1 (0 Ω) with a capacitor. Note that the AD8315’s RF input is internally ac-coupled. R2 = 52.3 Ω (Size 0603) R1 = 0 Ω (Size 0402) R3, R4, C2 Output Interface. R4 and C2 can be used to check the response of VAPC to capacitive and resistive loading. R3/R4 can be used to reduce the slope of VAPC. R4 = C2 = Open (Size 0603) R3 = 0 Ω (Size 0603) C1 Power Supply Decoupling. The nominal supply decoupling consists of a 0.1 μF capacitor. C1 = 0.1 μF (Size 0603) C4 Filter Capacitor. The response time of VAPC can be modified by placing a capacitor between FLTR (Pin 4) and ground. C4 = Open (Size 0603) LK1, LK2 Measurement Mode. A quasimeasurement mode can be implemented by installing LK1 and LK2 (connecting an inverted VAPC to VSET) to yield the nominal relationship between RFIN and VSET. In this mode, a large capacitor (0.01 μF or greater) must be installed in C4. LK1, LK2 = Installed |
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