Philips Semiconductors

ISP1105/1106/1107

Advanced USB transceivers

Product data

Rev. 06 — 30 November 2001

16 of 24

9397 750 08872

© Koninklijke Philips Electronics N.V. 2001. All rights reserved.

12. Package outline

Fig 12. HBCC16 package outline.

2.5

b

UNIT

D

Eh

e1

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

01-11-13

IEC

JEDEC

JEITA

mm

0.8

0.10

0.05

0.7

0.6

3.1

2.9

1.45

1.35

3.1

2.9

1.45

1.35

0.33

0.27

DIMENSIONS (mm are the original dimensions)

SOT639-2

MO-217

Dh

0.33

0.27

b1

0.38

0.32

b2

2.45

e3

E

0.23

0.17

f

0.5

w

e

yy1

0.1

0.05

0.2

2.5

e2

2.45

e4

0.08

v

0

2.5

5 mm

scale

SOT639-2

HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm

A

max.

detail X

y

y1 C

e

e

e1

e3

Dh

e4

D

E

X

C

B

A

16

113

59

e2

1/2 e3

1/2 e4

Eh

A1

A2

A

b2

b1

b2

b

f

terminal 1

index area

A

C

C

B

A

C

C

B

A

C

C

B

A

C

C

B