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EXAMPLE STENCIL DESIGN

2X (

)

1.705

.000 PKG

0

4X (0.25)

2X (

)

1.705

2X (

)

1.415

2X (

)

0.915

2X (

)

0.415

2X (

)

0.085

2X (

)

0.375

2X (

)

0.785

2X (

)

1.185

2X (

)

1.575

2X (

)

1.84

(

)

1.9

2X ( )

1

2X (

)

1.5

2X (

)

0.065

2X (

)

1.265

4X (0.3)

8X (0.25)

3X (0.22)

3X (0.6)

(R0.05) TYP

QFN-FCMOD - 2.1 mm max height

RDX0007A

PLASTIC QUAD FLATPACK - NO LEAD

4229109/A 10/2022

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE: 25X

PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

PADS: 1, 2, 3 & 4: 75%

1

2

3

4

5

7

EXPOSED METAL

EXPOSED METAL

METAL UNDER

SOLDER MASK

TYP

SOLDER MASK

OPENING

TYP