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TMD37253 Datasheet(PDF) 48 Page - OSRAM GmbH |
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TMD37253 Datasheet(HTML) 48 Page - OSRAM GmbH |
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48 / 56 page  Datasheet, Public Page 47 [v2-00] 2023-Mar-21 Document Feedback TMD3725 − Soldering & Storage Information Figure 64: Solder Reflow Profile Graph Storage Information Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package. To ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. Not to Scale – For Reference Only TP Time (seconds) tL TL TC - 5°C tP 25 Tsmin Tsmax Preheat Area Max Ramp Up Rate = 3°C/s Max Ramp Down Rate = 6°C/s |
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