5.3 Recommended Operating Conditions (continued)

over operating free-air temperature range (unless otherwise noted)(1)

MIN

NOM

MAX

UNIT

IOL

Low-level output current

VCC = 1.65 V

4

mA

VCC = 2.3 V

8

VCC = 2.7 V

12

VCC = 3 V

24

Δt/Δv

Input transition rise or fall rate

10

ns/V

TA

Operating free-air temperature

–40

125

°C

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report,

Implications of Slow or Floating CMOS Inputs.

5.4 Thermal Information

THERMAL METRIC(1)

SN74LVC126A

UNIT

BQA

(WQFN)

D (SOIC) DB (SSOP)

DGV

(TVSOP)

NS (SOP)

PW

(TSSOP)

RGY

(VQFN)

14 PINS

14 PINS

14 PINS

14 PINS

14 PINS

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal

resistance

102.3(3)

98.4(2)

112.2(2)

140.9(2)

93.9(2)

127.7(2)

35(3)

°C/W

RθJC(top)

Junction-to-case (top)

thermal resistance

96.8

58.2

64.2

59.9

51.7

56

43.6

°C/W

RθJB

Junction-to-board thermal

resistance

70.9

52.6

59.6

70.2

52.7

69.5

11.6

°C/W

ψJT

Junction-to-top

characterization parameter

16.6

24.1

28.3

9.1

20.7

8.9

0.4

°C/W

ψJB

Junction-to-board

characterization parameter

70.9

52.4

59.1

69.5

52.3

68.9

11.8

°C/W

RθJC(bot)

Junction-to-case (bottom)

thermal resistance

50.1

N/A

N/A

N/A

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

The package thermal impedance is calculated in accordance with JESD 51-7.

(3)

The package thermal impedance is calculated in accordance with JESD 51-5.

www.ti.com

SN74LVC126A

SCAS339T – MARCH 1994 – REVISED MAY 2024

Copyright © 2024 Texas Instruments Incorporated

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