9 Device and Documentation Support

9.1 Device Support

9.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT

CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES

OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

9.2 Documentation Support

9.2.1 Related Documentation

For related documentation see the following:

• Texas Instruments, TPSM8281xEVM-089 Evaluation Module User's Guide

• Texas Instruments, Achieving a Clean Start-up by Using a DC/DC Converter with a Precise Enable-pin

Threshold Technical Brief

• Texas Instruments, Design Considerations for a Resistive Feedback Divider in a DC/DC Converter Technical

Brief

• Texas Instruments, AN-1733 Load Transient Testing Simplified Application Report

• Texas Instruments, Five Steps to a Great PCB Layout for a Step-Down Converter Technical Brief

• Texas Instruments, Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs

9.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

9.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

9.5 Trademarks

MicroSIP™, and MagPack™, and TI E2E™ are trademarks of Texas Instruments.

All trademarks are the property of their respective owners.

9.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

TPSM82816

SLUSEY7A – DECEMBER 2022 – REVISED JUNE 2024

www.ti.com

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