www.ti.com

EXAMPLE BOARD LAYOUT

6X (0.75)

4X (1)

.000 PKG

0

0.05 MIN

ALL AROUND

0.05 MAX

ALL AROUND

(0.3)

(3.25)

6X (0.25)

(2.65)

4X (0.65)

2X (2)

2X (3.35)

4X (0.8)

4X (0.3)

4X (0.575)

4X (0.45)

(0.05) TYP

(R0.05) TYP

4X (1.4)

(0.3)

4X (

)

1.925

4X (

)

1.425

4X (

)

1.425

4X (

)

1.925

(

0.2) TYP

VIA

uSIP

- 2.4 mm max height

SIL0014B

MICRO SYSTEM IN PACKAGE

4225112/E 11/2020

1

5

10

LAND PATTERN EXAMPLE

SCALE:15X

6

11

12

13

14

METAL UNDER

SOLDER MASK

TYP

SOLDER MASK

OPENING

TYP

SEE DETAILS

COPPER KEEP-OUT AREA

TM

NOTES: (continued)

5. This package is designed to be soldered to thermal pads on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

6. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

NON SOLDER MASK

DEFINED

SOLDER MASK DEFINED

PADS 1, 5, 6, 10 AND 11 - 14

METAL UNDER

SOLDER MASK

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NOT TO SCALE

SOLDER MASK

OPENING

METAL