February 1994

21

Philips Semiconductors

Product specification

PAL/NTSC decoder

TDA3566A

SOLDERING

Plastic dual in-line packages

The maximum permissible

temperature of the solder is 260

°C;

this temperature must not be in

contact with the joint for more than

5 s. The total contact time of

successive solder waves must not

exceed 5 s.

The device may be mounted up to the

seating plane, but the temperature of

the plastic body must not exceed the

specified storage maximum. If the

printed-circuit board has been

pre-heated, forced cooling may be

necessary immediately after

soldering to keep the temperature

within the permissible limit.

Apply the soldering iron below the

seating plane (or not more than 2 mm

above it. If its temperature is below

300

°C, it must not be in contact for

more than 10 s; if between 300 and

400

°C, for not more than 5 s.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the specification

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.