LTM4612 datasheet(20/30 Pages) LINER

20 / 30 page

LTM4613

4613fd

For more information www.linear.com/LTM4613

Layout Checklist/Example

The high integration of LTM4613 makes the PCB board

layout very simple and easy. However, to optimize its

electrical and thermal performance, some layout consid-

erations are still necessary.

• Use large PCB copper areas for high current path, in-

cluding VIN, PGND and VOUT. It helps to minimize the

PCB conduction loss and thermal stress.

• Place high frequency ceramic input and output capaci-

tors next to the VD, PGND and VOUT pins to minimize

high frequency noise.

• Place a dedicated power ground layer underneath the

unit.

• Use round corners for the PCB copper layer to minimize

the radiated noise.

• To minimize the EMI noise and reduce module thermal

stress, use multiple vias for interconnection between

top layer and other power layers.

• Do not put vias directly on pads.

• If vias are placed onto the pads, the the vias must be

capped.

• Interstitial via placement can also be used if necessary.

• Use a separated SGND ground copper area for com-

ponents connected to signal pins. Connect the SGND

to PGND underneath the unit.

• Place one or more high frequency ceramic capacitors

close to the connection into the system board.

Figure17givesagoodexampleoftherecommendedlayout.

APPLICATIONS INFORMATION

Table 4. 5V Output

DERATING CURVE

VIN (V)

POWER LOSS CURVE

AIRFLOW (LFM)

HEAT SINK

θJA (°C/W)

Figure 11

Figure 10

None

8.5

Figure 11

Figure 10

200

None

6.5

Figure 11

Figure 10

400

None

6.5

Figure 12

Figure 10

BGA Heat Sink

Figure 12

Figure 10

200

BGA Heat Sink

Figure 12

Figure 10

400

BGA Heat Sink

Table 5. Heat Sink Manufacturers

HEAT SINK MANUFACTURER

PART NUMBER

WEBSITE

AAVID Thermalloy

375424B00034G

www.aavidthermalloy.com

Cool Innovations

4-050503P to 4-050508P

www.coolinnovations.com

Table 3. 12V and 15V Outputs

DERATING CURVE

VIN (V)

POWER LOSS CURVE

AIRFLOW (LFM)

HEAT SINK

θJA (°C/W)

Figures 13, 15

24, 36

Figure 9

None

Figures 13, 15

24, 36

Figure 9

200

None

Figures 13, 15

24, 36

Figure 9

400

None

Figures 14, 16

24, 36

Figure 9

BGA Heat Sink

9.5

Figures 14, 16

24, 36

Figure 9

200

BGA Heat Sink

6.5

Figures 14, 16

24, 36

Figure 9

400

BGA Heat Sink

6.5

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