© 2007 Microchip Technology Inc.

Preliminary

DS21836D-page 23

25AA1024/25LC1024

8-Lead Plastic Small Outline (SM) – Medium, 5.28 mm Body [SOIJ]

Notes:

1. SOIJ, JEITA/EIAJ Standard, formerly called SOIC.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

8

Pitch

e

1.27 BSC

Overall Height

A

1.77

–

2.03

Molded Package Thickness

A2

1.75

–

1.98

Standoff §

A1

0.05

–

0.25

Overall Width

E

7.62

–

8.26

Molded Package Width

E1

5.11

–

5.38

Overall Length

D

5.13

–

5.33

Foot Length

L

0.51

–

0.76

Foot Angle

φ

0°

–

8°

Lead Thickness

c

0.15

–

0.25

Lead Width

b

0.36

–

0.51

Mold Draft Angle Top

α

–

–

15°

Mold Draft Angle Bottom

β

–

–

15°

φ

β

α

L

c

A2

A1

A

b

12

e

E

E1

N

D

Microchip Technology Drawing C04-056B