PIC16CR74ESLASHP datasheet(122/172 Pages) MICROCHIP

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PIC16CR7X

DS21993C-page 120

IDD

Supply Current (Notes 2, 5)

D010

D010A

PIC16CR7X

—

0.5

μA

XT, RC osc configuration

FOSC = 4 MHz, VDD = 3.0V (Note 4)

LP osc configuration

FOSC = 32 kHz, VDD = 3.0V, WDT disabled

D010

D013

PIC16CR7X

—

1.1

6.3

XT, RC osc configuration

FOSC = 4 MHz, VDD = 5.5V (Note 4)

HS osc configuration

FOSC = 20 MHz, VDD = 5.5V

D015*

ΔIBOR Brown-out

Reset Current (Note 6)

—30

200

μA BOR enabled, VDD = 5.0V

D020

IPD

Power-down Current (Notes 3, 5)

D021

PIC16CR7X

—

2.0

0.1

μA

VDD = 3.0V, WDT enabled, -40

°C to +85°C

VDD = 3.0V, WDT disabled, -40

°C to +85°C

D020

D021

D021A

PIC16CR7X

—

0.1

10.5

1.5

μA

VDD = 4.0V, WDT enabled, -40

°C to +85°C

VDD = 4.0V, WDT disabled, -40

°C to +85°C

VDD = 4.0V, WDT enabled, -40

°C to

+125

°C

VDD = 4.0V, WDT disabled, -40

°C to

+125

°C

D023*

ΔIBOR Brown-out

Reset Current (Note 6)

—30

200

μA BOR enabled, VDD = 5.0V

15.1

DC Characteristics: PIC16CR73/74/76/77 (Industrial, Extended) (Continued)

PIC16CR73/74/76/77

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C

≤ TA ≤ +85°C for industrial

-40°C

≤ TA ≤ +125°C for extended

Param

No.

Sym

Characteristic

Min

Typ† Max Units

Conditions

Legend: Shading of rows is to assist in readability of of the table.

These parameters are characterized but not tested.

†

Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance

only and are not tested.

Note 1:

This is the limit to which VDD can be lowered without losing RAM data.

The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O

pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have

an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD

MCLR = VDD; WDT enabled/disabled as specified.

The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is

measured with the part in Sleep mode, with all I/O pins in high-impendance state and tied to VDD and VSS.

For RC osc configuration, current through REXT is not included. The current through the resistor can be

estimated by the formula Ir = VDD/2REXT (mA) with REXT in kOhm.

Timer1 oscillator (when enabled) adds approximately 20

μA to the specification. This value is from

characterization and is for design guidance only. This is not tested.

The

Δ current is the additional current consumed when this peripheral is enabled. This current should be

added to the base IDD or IPD measurement.

When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached.

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