PIC16CR74ESLASHP datasheet(154/172 Pages) MICROCHIP

154 / 172 page

PIC16CR7X

DS21993C-page 152

40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

INCHES

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

.100 BSC

Top to Seating Plane

–

.250

Molded Package Thickness

.125

–

.195

Base to Seating Plane

.015

–

Shoulder to Shoulder Width

.590

–

.625

Molded Package Width

.485

–

.580

Overall Length

1.980

–

2.095

Tip to Seating Plane

.115

–

.200

Lead Thickness

.008

–

.015

Upper Lead Width

.030

–

.070

Lower Lead Width

.014

–

.023

Overall Row Spacing §

–

.700

NOTE 1

12 3

Microchip Technology Drawing C04-016B

PIC16CR74E/P Datasheet(PDF) 154 Page - Microchip Technology

PIC16CR74E/P Datasheet(HTML) 154 Page - Microchip Technology

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