5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

7

V

IIK

Input diode current

For VI < –0.5 V or VI > VCC + 0.5 V

±20

mA

IOK

Output diode current

For VO < –0.5 V or VO > VCC + 0.5 V

±20

mA

IO

Output source or sink current per output pin

For VO > –0.5 V or VO < VCC + 0.5 V

±25

mA

Continuous current through VCC or GND

±50

mA

TJ

Junction temperature

150

°C

Tstg

Storage temperature

– 65

150

°C

Maximum lead temperature (Soldering 10s) (SOIC - lead tips only)

300

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

5.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage range

HC types

2

6

V

HCT types

4.5

5.5

VI,

VO

Input or output voltage

0

VCC

V

tt

Input rise and fall time

2 V

1000

ns

4.5 V

500

6 V

400

TA

Temperature range

–55

125

°C

5.3 Thermal Information

THERMAL METRIC

N (PDIP)

D (SOIC)(2)

NS (SOP)

PW (TSSOP)

UNIT

PINS

PINS

PINS

PINS

RθJA

Junction-to-ambient thermal resistance(1)

67

73

64

108

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

(2)

Lead tips only

CD54HC4094, CD74HC4094, CD74HCT4094

SCHS211F – NOVEMBER 1997 – REVISED MARCH 2022

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