SC1458

11

PCB Layout Considerations

While layout for linear devices is generally not as critical

as for a switching application, careful attention to detail

will ensure reliable operation.

Attach the part to a large copper footprint,

particularly the thermal pad on the underside

of the device, to enable better heat transfer,

particularly

on

PCBs

where

there

are

internal power and ground planes.

Place the input, output, and bypass capacitors

close to the device for optimal transient

response and device behavior.

•

•

Applications Information (continued)

Connect all ground connections directly to the

ground plane whenever possible to minimize

ground potential differences on the PCB.

Ensure that the feedback resistors are placed as

close as possible to the feedback pins.

•

•

SC1458B