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STM32U385CG Datasheet(PDF) 184 Page - STMicroelectronics |
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STM32U385CG Datasheet(HTML) 184 Page - STMicroelectronics |
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184 / 224 page ![]() 6.2 UFQFPN32 package information (A0B8) This UFQFPN is a 32 pins, 5 x 5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package. Figure 67. UFQFPN32 - Outline D2 e E2 L e BOTTOM VIEW PIN 1 identifier Chamfer or Circular arc shape EXPOSED PAD FRONT VIEW C SEATING PLANE SEATING PLANE C ddd DETAIL A DETAIL A PIN 1 IDENTIFIER LASER MARKING AREA E D TOP VIEW fff C A B fff C A B b bbb C A B ddd C R0.20 eee C A1 A3 A ccc C A1 A3 C B A 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. STM32U385xx Package information DS14830 - Rev 2 page 184/224 |
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