C

TYP

3.5

3.1

2X 0.15 MAX

0.9 MAX

0.05

0.00

(0.2)

1.74±0.1

2.45±0.1

0.565±0.1

4X

0.52

0.32

4X

0.55

0.25

0.65 TYP

2X 1.95

8X

0.35

0.25

(0.15) TYP

2X (0.2)

4X 1.45

B

3.1

2.9

A

3.25

3.05

4222499/A 12/2015

9

PIN 1 INDEX AREA

SEATING PLANE

0.1

C B

A

0.05

C

2X

NOTE 4

EXPOSED THERMAL PAD

NOTE 3

1

4

5

8

8

CSD18543Q3A

SLPS633 – DECEMBER 2016

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Product Folder Links: CSD18543Q3A

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Copyright © 2016, Texas Instruments Incorporated

7 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

7.1 Q3A Package Dimensions

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning

and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical

performance.

4. Metalized features are supplier options and may not be on the package.

5. All dimensions do not include mold flash or protrusions.