4X (0.6)

4X (0.3)

(1.775)

(2.45)

0.05 MIN

ALL SIDES

3X (0.65)

3X (0.65)

(0.207)

(0.975)

TYP

(R

)

TYP

0.05

(0.245)

(0.905)

TYP

(R

) TYP

0.05

(1.55)

(0.56)

(0.635)

TYP

(

) VIA

TYP

0.2

4X (0.3)

LAND PATTERN EXAMPLE

SYMM

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

1

4

5

8

9

PKG

9

CSD18543Q3A

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SLPS633 – DECEMBER 2016

Product Folder Links: CSD18543Q3A

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Copyright © 2016, Texas Instruments Incorporated

7.2 Q3A Recommended PCB Pattern

1. This package is designed to be soldered to a thermal pad on the board. For more information, see QFN/SON

PCB Attachment (SLUA271).

2. Vias are optional depending on application, refer to device data sheet. If some or all are implemented,

recommended via locations are shown.

For recommended circuit layout for PCB designs, see Reducing Ringing Through PCB Layout Techniques

(SLPA005).