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33800 Datasheet(PDF) 6 Page - Freescale Semiconductor, Inc

Part # 33800
Description  Engine Control Integrated Circuit
PDF  39 Pages
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

33800 Datasheet(HTML) 6 Page - Freescale Semiconductor, Inc

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Analog Integrated Circuit Device Data
6
Freescale Semiconductor
33800
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
VPWR
VDD
VPWR
VDD
-1.5 to 45
-0.3 to 7.0
VDC
CS,
SI, SO, SCLK, EN, DEFAULT, PWMx, P1, P3, P5, P7
–
-0.3 to VDD
VDC
Predriver Drain Voltage (VDSNS1 to VDSNS6)
VDSNS
-0.3 to 60
VDC
OSS Output Clamp Energy (OUT3 to OUT8)(Single Pulse)
TJunction = 150°C, IOUT = 0.45A
ECLAMP
30
mJ
OSS Output Clamp Energy (OUT1 & OUT2)(Single Pulse)
TJunction = 150°C, IOUT = 0.45A
ECLAMP
45
mJ
CCD1 Output Clamp Energy (Single Pulse)
TJunction = 150°C, IOUT = 0.45A
ECLAMP
75
mJ
CCD2 Output Clamp Energy (Single Pulse)
TJunction = 150°C, IOUT = 0.45A
ECLAMP
25
mJ
OSS Output Continuous Current (OUT1 to OUT8 Steady State)
TJunction = 150°C
IOSS_SS
350
mA
CCD1 Output Clamp Energy (CCD1_REC OUTPUT)
TJunction = 150°C, IOUT = 1.0 A
ECLAMP
75
mJ
Frequency of SPI Operation (VDD = 5.0V)
(3)
–
4.0
MHz
ESD Voltage(1)
Human Body Model
Machine Model
VESD1
VESD2
±2000
±200
V
THERMAL RATINGS
Storage Temperature
TSTG
-55 to 150
°C
Operating Case Temperature
TC
-40 to 125
°C
Operating Junction Temperature
TJ
-40 to 150
°C
Power Dissipation (TA = 25°C)
(2)
PD
1.7
W
THERMAL RESISTANCE
Thermal Resistance
Junction to Ambient
Between the Die and the Exposed Die Pad
RθJA
RθJC
71
1.2
°C/W
Notes
1.
ESD data available upon request. All pins tested individually. ESD1 testing is performed in accordance with the Human Body Model
(AEC-Q100-002). and the Machine Model (AEC-Q100-003).
2.
Maximum power dissipation at TJ =150°C junction temperature with no heat sink used.
3.
This parameter is guaranteed by design but is not production tested.



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