TMP116 datasheet(36/46 Pages) TI2

36 / 46 page

TI Device

SCL

SDA

GND

V+

ALERT

ADD0

100 nF

≥

0.5 kΩ

1.9 V to 5.5 V

TMP116, TMP116N

SBOS740A – MAY 2017 – REVISED MAY 2019

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Product Folder Links: TMP116

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9 Power Supply Recommendations

The TMP116 operates on a power-supply range from 1.9 V to 5.5 V. The device is trimmed for operation at a

3.3-V supply, but can measure temperature accurately in the full supply range. A power-supply bypass capacitor

is required, which must be placed as close as possible to the device. A recommended value for this supply

bypass capacitor is 100 nF. Applications with noisy or high-impedance power supplies may require additional

decoupling capacitors to reject power-supply noise.

The TMP116 is a very low-power device and generates low noise on the supply bus. Applying an RC filter to the

V+ pin of the device can further reduce any noise that the TMP116 might propagate to other components. RF in

Figure 44 must be less than 0.5 k

Ω and CF must be at least 100 nF. Take care that the V+ pin voltage is not less

than 1.9 V. The package thermal pad is not connected to the device ground and should be left unsoldered for the

best measurement accuracy. If the thermal pad is soldered it must be left floating or connected to ground.

Figure 44. Noise-Reduction Techniques

10 Layout

10.1 Layout Guidelines

NOTE

To achieve a high precision temperature reading for a rigid PCB, do not solder down the

thermal pad. For a flexible PCB, the user can solder the thermal pad to increase board

level reliability. If thermal pad is soldered it should be connected to the ground or left

floating.

For more information on board layout, refer to the related Precise Temperature Measurements With TMP116

(SNOA986) and Wearable Temperature Sensing Layout Considerations Optimized for Thermal Response

(SNIA021) application reports on ti.com.

Place the power-supply bypass capacitor as close as possible to the supply and ground pins. The recommended

value of this bypass capacitor is 0.1 μF. In some cases, the pullup resistor can be the heat source, therefore,

maintain some distance between the resistor and the device.

Mount the TMP116 on the PCB pad to provide the minimum thermal resistance to the measured object surface

or to the surrounding air. The PCB layout should minimize the device self-heating effect, reduce the time delay

as temperature changes, and minimize the temperature offset between the device and the measured object.

1. Soldering the TMP116 thermal pad to the PCB minimizes the thermal resistance to the PCB, reduces the

response time as temperature changes and minimizes the temperature offset between the device and

measured object. Simultaneously the soldering of the thermal pad will, however, introduce mechanical stress

that can be a source of additional measurement error. For cases when system calibration is not planned, TI

recommends not soldering the thermal pad to the PCB. Due to the small thermal mass of the device, not

soldering the thermal pad will have a minimal impact on the described characteristics. Manual device

soldering to PCB creates additional mechanical stress to package, therefore to prevent precision degradation

TMP116 Datasheet(PDF) 36 Page - Texas Instruments

TMP116 Datasheet(HTML) 36 Page - Texas Instruments

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