INA129-EP

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SBOS508A – DECEMBER 2009 – REVISED DECEMBER 2015

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VS

Supply voltage

±18

V

Analog input voltage

±40

V

Output short-circuit (to ground)

Continuous

TA

Operating temperature

–55

125

°C

TJ

Junction temperature

150

°C

Lead temperature (soldering, 10s)

300

°C

Tstg

Storage temperature

–55

125

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±4000

V(ESD)

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

±200

pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

V power supply

±2.25

±15

±18

V

Input common-mode voltage range for VO = 0

V - 2 V

V + –2 V

TA operating temperature INA129-EP

–55

125

°C

6.4 Thermal Information

INA129-EP

THERMAL METRIC(1)

D (SOIC)

UNIT

8 PINS

RθJA

Junction-to-ambient thermal resistance

110

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

57

°C/W

RθJB

Junction-to-board thermal resistance

54

°C/W

ψJT

Junction-to-top characterization parameter

11

°C/W

ψJB

Junction-to-board characterization parameter

53

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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