PACKAGE OPTION ADDENDUM

www.ti.com

2-May-2025

PACKAGING INFORMATION

Orderable

part number

Status

(1)

Material type

(2)

Package | Pins

Package qty | Carrier

RoHS

(3)

Lead finish/

Ball material

(4)

MSL rating/

Peak reflow

(5)

Op temp (°C)

Part marking

(6)

LM74CIM-3

Last

Time Buy

Production

SOIC (D) | 8

95 | TUBE

No

Call TI

Level-1-235C-UNLIM

-55 to 150

LM74

CIM3

LM74CIM-3/NOPB

Obsolete

Production

SOIC (D) | 8

-

-

Call TI

Call TI

-55 to 150

LM74

CIM3

LM74CIM-5

NRND

Production

SOIC (D) | 8

95 | TUBE

No

Call TI

Level-1-235C-UNLIM

-55 to 150

LM74

CIM5

LM74CIM-5/NOPB

Obsolete

Production

SOIC (D) | 8

-

-

Call TI

Call TI

-55 to 150

LM74

CIM5

LM74CIMX-3

NRND

Production

SOIC (D) | 8

2500 | LARGE T&R

No

Call TI

Level-1-235C-UNLIM

-55 to 150

LM74

CIM3

LM74CIMX-3/NOPB

Active

Production

SOIC (D) | 8

2500 | LARGE T&R

Yes

SN

Level-1-260C-UNLIM

-55 to 150

LM74

CIM3

LM74CIMX-5/NOPB

Active

Production

SOIC (D) | 8

2500 | LARGE T&R

Yes

SN

Level-1-260C-UNLIM

-55 to 150

LM74

CIM5

LM74CITP-3/NOPB

Obsolete

Production

DSBGA (YTA) | 5

-

-

Call TI

Call TI

-40 to 125

10

LM74CITPX-3/NOPB

Active

Production

DSBGA (YTA) | 5

3000 | LARGE T&R

Yes

SNAGCU

Level-1-260C-UNLIM

-40 to 125

10

(1) Status: For more details on status, see our product life cycle.

(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without

limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available

for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the

finish value exceeds the maximum column width.

(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per

JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Addendum-Page 1