LM74

www.ti.com

SNIS107K – MAY 2000 – REVISED MARCH 2013

Absolute Maximum Ratings

(1)

Supply Voltage

−0.3V to 6.0V

Voltage at any Pin

−0.3V to V+ + 0.3V

Input Current at any Pin(2)

5 mA

Package Input Current(2)

20 mA

Storage Temperature

−65°C to +150°C

ESD Susceptibility(3)

Human Body Model

LM74CIBP and LM74CITP, pin A2 (SC)

1900V

LM74CIM,LM74CIBP, and LM74CITP all other pins

2000V

Machine Model

200V

Soldering process must comply with Reflow Temperature Profile specifications. See www.ti.com/packaging.(4)

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not

apply when operating the device beyond its rated operating conditions.

(2)

When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > +VS) the current at that pin should be limited to 5

mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input

current of 5 mA to four.

(3)

Human body model, 100 pF discharged through a 1.5 k

Ω resistor. Machine model, 200 pF discharged directly into each pin.

(4)

Reflow temperature profiles are different for lead-free and non-lead-free packages.

Operating Ratings

Specified Temperature Range

TMIN to TMAX

See(1)

LM74CIBP and LM74CITP

−40°C to +125°C

LM74CIM

−55°C to +150°C

Supply Voltage Range (+VS)

LM74CIBP and LM74CITP

+2.65V to +5.5V

LM74CIM

+3.0V to +5.5V

(1)

The life expectancy of the LM74 will be reduced when operating at elevated temperatures. LM74

θJA (thermal resistance, junction-to-

ambient) when attached to a printed circuit board with 2 oz. foil is summarized as: Device Number LM74CIM Thermal Resistance (

θJA)

160°C/W. Device Number LM74CIBP Thermal Resistance (

θJA) 250°C/W. Device Number LM74CITP Thermal Resistance (θJA)

250°C/W.

Copyright © 2000–2013, Texas Instruments Incorporated

Submit Documentation Feedback

3

Product Folder Links: LM74