8

8 - 13

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Outline Drawing

Absolute Maximum Ratings

Collector Bias Voltage (Vcc)

+7 Vdc

RF Input Power (RFIN)(Vs = +5 Vdc)

+10 dBm

Junction Temperature

150 °C

Continuous Pdiss (T = 85 °C)

(derate 5.21 mW/°C above 85 °C)

0.339 W

Thermal Resistance

(junction to ground paddle)

192 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE

SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED

LAND PATTERN.

InGaP HBT GAIN BLOCK

MMIC AMPLIFIER, DC - 6 GHz

v03.0907

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC311LP3

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

311

XXXX

HMC311LP3E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

311

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS