4

TCA9803

SCPS267B – MARCH 2017 – REVISED FEBRUARY 2020

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Copyright © 2017–2020, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCCA

Supply voltage on A-side

–0.5

4

V

VCCB

Supply voltage on B-side

–0.5

4

V

VEN

Enable input voltage

–0.5

4

V

VI/O

I2C bus voltage

–0.5

4

V

IOL

Maximum SDAA, SCLA IOL current

20

mA

IIK

Input clamp current (SDAB/SCLB)

–20

mA

Input clamp current (EN, VCCA, VCCB, SDAA, SCLA)

–20

mA

IOK

Output clamp current (SDAB/SCLB)

–20

mA

Output clamp current (EN, VCCA, VCCB, SDAA, SCLA)

–20

mA

Operating junction

temperature

TJ

130

°C

Storage temperature

Tstg

–60

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-

001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC specification

JESD22-C101, all pins(2)

±1000

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

TA

Operating free-air temperature

–40

125

°C

VCCA

Supply voltage

0.8

3.6

V

VCCB

Supply voltage

1.65

3.6

V

VI/O

Input-output voltage

SDAA, SCLA

0

3.6

V

SDAB, SCLB

0

3.6

EN

0

3.6

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

TCA9803

UNIT

DGK (VSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

174.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

85

°C/W

RθJB

Junction-to-board thermal resistance

104.4

°C/W

ΨJT

Junction-to-top characterization parameter

18.3

°C/W

ΨJB

Junction-to-board characterization parameter

102.8

°C/W