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LP2985LV-N

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SNOS510Q – NOVEMBER 1999 – REVISED OCTOBER 2016

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10.3 DSBGA Mounting

The DSBGA package requires specific mounting techniques which are detailed in AN-1112 DSBGA Wafer Level

Chip Scale Package. Referring to the section Surface Mount Technology (SMT) Assembly Considerations, note

that the pad style which must be used with the 5-pin package is the NSMD (non-solder mask defined) type.

For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the

DSBGA device.

10.4 DSBGA Light Sensitivity

Exposing the DSBGA device to direct sunlight cause misoperation of the device. Light sources such as Halogen

lamps can also affect electrical performance if brought near to the device.

The wavelengths which have the most detrimental effect are reds and infra-reds, which means that the

fluorescent lighting used inside most buildings has very little effect on performance. A DSBGA test board was

brought to within 1 cm of a fluorescent desk lamp and the effect on the regulated output voltage was negligible,

showing a deviation of less than 0.1% from nominal.