THS6032

SLOS233F – APRIL 1999 – REVISED AUGUST 2009....................................................................................................................................................... www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

DESCRIPTION

The THS6032 is a low-power line driver ideal for asymmetrical digital subscriber line (ADSL) applications. This

device contains two high-current, high-speed current-feedback drivers, which can be configured differentially for

driving ADSL signals at the central office. The THS6032 features a unique class-G architecture to lower power

consumption to 1.35 W. The THS6032 can also be operated in a traditional class-AB mode to reduce the number

of power supplies to two.

The class-G architecture supplies current to the load from four supplies. For low output voltages (typically –2.5 <

VO < +2.5), some of the output current is supplied from the +VCC(L) and –VCC(L) supplies (typically ±5 V). For large

output voltages (typically VO < –2.5 and VO > +2.5), the output current is supplied from +VCC(H) and –VCC(H)

(typically ±15 V). This current sharing between VCC(L) and VCC(H) minimizes power dissipation within the THS6032

output stages for high crest factor ADSL signals.

The THS6032 features a low-impedance shutdown mode, which allows the central office to receive incoming

calls even after the device has been shut down. The THS6032 is available packaged in the patented

PowerPAD ™ package. This package provides outstanding thermal characteristics in a small-footprint

surface-mount package, which is fully compatible with automated surface-mount assembly procedures. It is also

available in the new MicroStar Junior ™ BGA package. This package is only 25 mm2 in area, allowing for

high-density PCB designs.

Shutdown (SHDN1 and SHDN2) allows for powering down the internal circuitry for power conservation or for

multiplexing. Separate shutdown controls are available for each channel on the THS6032. The control levels are

TTL compatible. When turned off, each driver output is placed in a low impedance state which is determined by

the voltage at DGND. This virtual ground at the outputs allows proper termination of a transmission line.

AVAILABLE OPTIONS(1)

PACKAGED DEVICES

TA

PowerPAD PLASTIC

PowerPAD PLASTIC

EVALUATION

PowerPAD TQFP

(VFP)

SMALL OUTLINE (2) (DWP)

MSOP (3) (GQE)

MODULES

THS6032 EVM (DWP package)

0°C to +70°C

THS6032CDWP

THS6032CGQER

THS6032CVFP

THS6032GQE EVM (GQE package)

–40°C to +85°C

THS6032IDWP

THS6032IGQER

THS6032IVFP

—

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

The DWP packages are available taped and reeled. Add an R suffix to the device type (for example, THS6032CDWPR).

(3)

The GQE packages are only available taped and reeled.

2

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Product Folder Link(s): THS6032