7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VSUP (2)

Supply line supply voltage

Continuous

0

27

V

Transient

0

40

V

NWake DC and transient input voltage (through 33-kΩ serial resistor)

–1

40

V

Logic pin input voltage (RXD, TXD, EN)

–0.3

5.5

V

LIN DC input voltage

–40

40

V

TA

Operational free-air temperature

–40

125

°C

TJ

Junction temperature

–40

150

°C

Thermal shutdown

200

°C

Thermal shutdown hysteresis

25

°C

Tstg

Storage temperature range

–40

165

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Section 7.3 is not implied.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to GND.

7.2 ESD Ratings

VALUE

UNIT

V(ESD) Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC

JS-001(1) (2)

LIN pin

±12000

V

NWake pin

±9000

All other pins

±3000

Machine model(3)

LIN and NWake pins

±400

All other pins

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.

(3)

The machine model is a 200-pF capacitor through a 10-Ω resistor and a 0.75-µH coil.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

TSUP

Supply voltage

7

27

V

TAMB

Ambient temperature

–40

125

°C

7.4 Thermal Information

THERMAL METRIC(1)

TPIC1021

UNIT

D (SOIC)

8 PINS

RθJA

Junction-to-ambient thermal resistance

145

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

61.9

°C/W

RθJB

Junction-to-board thermal resistance

55.5

°C/W

ψJT

Junction-to-top characterization parameter

14.3

°C/W

ψJB

Junction-to-board characterization parameter

55

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TPIC1021

SLIS113E – OCTOBER 2004 – REVISED MAY 2022

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