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CSD23382F4.B Datasheet(PDF) 1 Page - Texas Instruments

Part # CSD23382F4.B
Description  CSD23382F4 12-V P-Channel FemtoFET™ MOSFET
PDF  14 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

CSD23382F4.B Datasheet(HTML) 1 Page - Texas Instruments

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CSD23382F4 12-V P-Channel FemtoFET™ MOSFET
1 Features
• Low on-resistance
• Ultra-low Qg and Qgd
• Ultra-small footprint (0402 case size)
– 1.0 mm × 0.6 mm
• Low profile
– 0.36-mm maximum height
• Integrated ESD protection diode
– Rated > 2-kV HBM
– Rated > 2-kV CDM
• Pb terminal plating
• Halogen free
• RoHS compliant
2 Applications
• Optimized for load switch applications
• Optimized for general purpose switching
applications
• Battery applications
• Handheld and mobile applications
3 Description
This 66-mΩ, 12-V P-channel FemtoFET™ MOSFET
is designed and optimized to minimize the footprint
in many handheld and mobile applications. This
technology is capable of replacing standard small
signal MOSFETs while providing at least a 60%
reduction in footprint size.
.
1.00 mm
0.36 mm
0.60 mm
Typical Device Dimensions
.
.
Product Summary
TA = 25°C
TYPICAL VALUE
UNIT
VDS
Drain-to-source voltage
–12
V
Qg
Gate charge total (–4.5 V)
1.04
nC
Qgd
Gate charge gate-to-drain
0.15
nC
RDS(on)
Drain-to-source on-resistance
VGS = –1.8 V
149
mΩ
VGS = –2.5 V
90
VGS = –4.5 V
66
VGS(th)
Threshold voltage
–0.8
V
Ordering Information(1)
DEVICE
QTY
MEDIA
PACKAGE
SHIP
CSD23382F4
3000
7-inch reel
Femto (0402)
1.0 mm × 0.6 mm
Land Grid Array (LGA)
Tape and
reel
CSD23382F4T
250
7-inch reel
(1)
For all available packages, see the orderable addendum at
the end of the data sheet.
Absolute Maximum Ratings
TA = 25°C
VALUE
UNIT
VDS
Drain-to-source voltage
–12
V
VGS
Gate-to-source voltage
±8
V
ID
Continuous drain current(1)
–3.5
A
IDM
Pulsed drain current, TA = 25°C(2)
–22
A
IG
Continuous gate clamp current
–35
mA
Pulsed gate clamp current(2)
–350
PD
Power dissipation(1)
500
mW
V(ESD)
Human body model (HBM)
2
kV
Charged device model (CDM)
2
kV
TJ,
Tstg
Operating junction and
storage temperature range
–55 to 150
°C
(1)
Typical RθJA = 85°C/W on 1-inch2 (6.45 cm2), 2-oz.
(0.071-mm thick) Cu pad on a 0.06-inch (1.52 mm) thick FR4
PCB.
(2)
Pulse duration ≤ 100 μs, duty cycle ≤ 1%
D
S
G
Top View
CSD23382F4
SLPS453E – MAY 2014 – REVISED JANUARY 2022
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.


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