LM2736

SNVS316H – SEPTEMBER 2004 – REVISED DECEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN

-0.5

22

V

SW Voltage

-0.5

22

V

Boost Voltage

-0.5

28

V

Boost to SW Voltage

-0.5

8

V

FB Voltage

-0.5

3

V

EN Voltage

-0.5

VIN + 0.3

V

Junction Temperature

150

°C

Infrared/Convection Reflow (15sec)

220

°C

Soldering

Information

Wave Soldering Lead temperature (10sec)

260

°C

Tstg

Storage temperature

-65

150

°C

(1)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM),

V(ESD)

Electrostatic discharge

±2000

V

per ANSI/ESDA/JEDEC JS-001, all pins(1)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

3

18

V

SW Voltage

-0.5

18

V

Boost Voltage

-0.5

23

V

Boost to SW Voltage

1.6

5.5

V

Junction Temperature Range

−40

125

°C

6.4 Thermal Information

LM2736

THERMAL METRIC(1)

DDC

UNIT

6 PINS

RθJA

(2)

Junction-to-ambient thermal resistance

158.1

RθJC(top)

Junction-to-case (top) thermal resistance

46.5

RθJB

Junction-to-board thermal resistance

29.5

°C/W

ψJT

Junction-to-top characterization parameter

0.8

ψJB

Junction-to-board characterization parameter

29.2

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

Thermal shutdown will occur if the junction temperature exceeds 165°C. The maximum power dissipation is a function of TJ(MAX) , θJA

and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/θJA . All numbers apply for

packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air. For a 2 layer board using 1 oz. copper in still

air,

θJA = 204°C/W.

4

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