Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Device Comparison Table...............................................4

6 Pin Configuration and Functions...................................5

7 Specifications.................................................................. 6

7.1 Absolute Maximum Ratings........................................ 6

7.2 ESD Ratings............................................................... 6

7.3 Recommended Operating Conditions.........................6

7.4 Thermal Information....................................................7

7.5 Power Ratings.............................................................7

7.6 Insulation Specifications ............................................ 8

7.7 Safety-Related Certifications ..................................... 9

7.8 Safety Limiting Values ................................................9

7.9 Electrical Characteristics...........................................10

7.10 Switching Characteristics........................................12

7.11 Timing Diagram....................................................... 12

7.12 Insulation Characteristics Curves........................... 13

7.13 Typical Characteristics............................................ 14

8 Detailed Description......................................................20

8.1 Overview................................................................... 20

8.2 Functional Block Diagram......................................... 20

8.3 Feature Description...................................................20

8.4 Device Functional Modes..........................................22

9 Application and Implementation.................................. 23

9.1 Application Information............................................. 23

9.2 Typical Application.................................................... 23

9.3 What To Do and What Not To Do..............................26

10 Power Supply Recommendations..............................27

11 Layout........................................................................... 28

11.1 Layout Guidelines................................................... 28

11.2 Layout Example...................................................... 28

12 Device and Documentation Support..........................29

12.1 Documentation Support.......................................... 29

12.2 Receiving Notification of Documentation Updates..29

12.3 Support Resources................................................. 29

12.4 Trademarks.............................................................29

12.5 Electrostatic Discharge Caution..............................29

12.6 Glossary..................................................................29

13 Mechanical, Packaging, and Orderable

Information.................................................................... 29

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (May 2020) to Revision C (June 2022)

Page

• Changed isolation standard from DIN VDE V 0884-11 (VDE V 0884-11) to DIN EN IEC 60747-17 (VDE

0884-17) and updated the Insulation Specifications and Safety-Related Certifications tables accordingly....... 1

• Changed Features section..................................................................................................................................1

• Changed pin names: VIN to IN, VOUTP to OUTP, and VOUTN to OUTN......................................................... 5

• Merged VOS specs for 4.5V ≤ VDD1 ≤ 5.5 V and 3.0 V ≤ VDD1 ≤ 5.5 V ranges (AMC1311B only).................10

• Changed VDD1 DC PSRR from –65 dB (typical) to –80 dB (typical)............................................................... 10

• Changed CMTI from 75 kV/µs (minimum), 140 kV/µs (typical) to 100 kV/µs (minimum), 150kV/µs (typical)

(AMC1311B only)..............................................................................................................................................10

• Changed VDD1UV (VDD1 falling) from 1.75 V / 2.53 V / 2.7 V to 2.4 V / 2.6 V / 2.8 V (minimum / typical /

maximum)......................................................................................................................................................... 10

• Changed Rise, Fall, and Delay Time Definition timing diagram....................................................................... 12

• Changed Reinforced Isolation Capacitor Lifetime Projection figure ................................................................ 13

• Changed functional block diagram................................................................................................................... 20

• Deleted Fail-Safe Output section, added Analog Output section..................................................................... 22

• Changed Typical Application section and subsections..................................................................................... 23

• Changed What To Do and What Not To Do section......................................................................................... 26

• Changed Layout section................................................................................................................................... 28

AMC1311

SBAS786C – DECEMBER 2017 – REVISED JUNE 2022

www.ti.com

2

Submit Document Feedback

Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: AMC1311