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MCSH43X104FCT Datasheet(PDF) 6 Page - Multicomp Pro

Part # MCSH43X104FCT
Description  Soft Termination Standard voltage Soft Termination Multilayer SMD Ceramic Capacitor
PDF  15 Pages
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Manufacturer  MULTICOMP [Multicomp Pro]
Direct Link  https://www.multicomp-pro.com/
Logo MULTICOMP - Multicomp Pro

MCSH43X104FCT Datasheet(HTML) 6 Page - Multicomp Pro

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Page <6>
V1.1
09/09/19
Soft Termination Standard voltage Soft Termination Multilayer
SMD Ceramic Capacitor
NP0, X7R, X5R & Y5V Dielectrics, 0402 to 1812 Sizes, 6.3V to 100V, (MCSHSeries)
Newark.com/multicomp-pro
Farnell.com/multicomp-pro
Element14.com/multicomp-pro
No
Item
Test Condition
Requirements
6
Temperature
Coefficient
With no electrical load.
T.C.
Operating Temp
NPO
-55~125°C at 25°C
X7R
-55~125°C at 25°C
X5R
-55~ 85°C at 25°C
X6S
-55~105°C at 25°C
Y5V
-25~ 85°C at 20°C
T.C.
Capacitance Change
NPO
Within ±30ppm/°C
X7R
Within ±15%
X5R
Within ±15%
X6S
Within ±22%
Y5V
Within +30%/-80%
7
Adhesive
Strength of
Termination
Pressurizing force:
5N(≤0603)and10N(>0603)
Test time: 10±1 sec.
Noremarkabledamageorremovaloftheterminations.
8
Vibration
Resistance
Vibration frequency: 10~55 Hz/min.
Total amplitude: 1.5mm
Test time: 6 hrs. (Two hrs each in three
mutually perpendicular directions.)
Measurementtobemadeafterkeeping
at room temp. for 24±2 hrs.
Noremarkabledamage.
CapchangeandQ/D.F.:Tomeetinitialspec.
9
Solderability
Solder temperature: 235±5°C
Dipping time: 2±0.5 sec.
95% min. coverage of all metalized area.
10 Bending Test
The middle part of substrate shall be
pressurized by means of the pressur-
izing rod at a rate of about 1mm per
seconduntilthedeflectionbecomes:
5mm and then the pressure shall be
maintained for 5±1 sec.
Measurementtobemadeafterkeeping
at room temp. for 24±2 hrs.
Noremarkabledamage.
Cap change:
NP0: within ±5% or 0.5pF whichever is larger
X7R, X5R, X6S: within ±12.5%
Y5V: within ±30%
(This capacitance change means the change of capacitance
underspecifiedflexureofsubstratefromthecapacitance
measured before the test.)
11
Resistance
to Soldering
Heat
Solder temperature: 260±5°C
Dipping time: 10±1 sec
Preheating: 120 to 150°C for 1 minute
before immerse the capacitor in a
eutectic solder.
Before initial measurement (Class II
only): Perform 150+0/-10°C for 1 hr and
then set for 24±2 hrs at room temp.
Measurementtobemadeafterkeeping
at room temp. for 24±2 hrs.
Noremarkabledamage.
Cap change:
NP0: within ±2.5% or 0.25pF whichever is larger
X7R, X5R, X6S: within ±7.5%
Y5V: within ±20%
Q/D.F.,I.R.anddielectricstrength:Tomeetinitial
requirements.
25%max.leachingoneachedge.
12 Temperature
Cycle
*Conductthefivecyclesaccordingto
the temperatures and time.
Step
Temp. (°C)
Time (min.)
1
Min. operating
temp. +0/-3
30±3
2
Room temp.
2~3
3
Max.operating
temp. +3/-0
30±3
4
Room temp.
2~3
Noremarkabledamage.
Cap change:
NP0: within ±2.5% or 0.25pF whichever is larger
X7R, X5R, X6S: within ±7.5%
Y5V: within ±20%
Q/D.F.,I.R.anddielectricstrength:Tomeetinitial
requirements.



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